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研究生: 李昂倖
論文名稱: 碲化鉛熱電材料與銅電極之填料接合性質研究
Study on the interface properties of PbTe thermoelectric material and Cu electrode joined
指導教授: 程金保
學位類別: 碩士
Master
系所名稱: 機電工程學系
Department of Mechatronic Engineering
論文出版年: 2012
畢業學年度: 101
語文別: 中文
論文頁數: 93
中文關鍵詞: 熱電材料真空硬銲PbTeAgCuTi銲片SnAgTi銲片AlSi銲片
英文關鍵詞: Thermoelectric materials, Vacuum brazing, PbTe, AgCuTi filler, SnAgTi filler, AlSi filler
論文種類: 學術論文
相關次數: 點閱:219下載:9
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  • 熱電材料可將熱能轉換成為電能,但其模組製作是一大挑戰,特別是熱電材料與電極接合之技術。PbTe是重要的中高溫熱電材料,本研究改變不同填料,在真空環境中進行PbTe熱電材料與銅電極之接合,實驗結果發現,利用固態擴散接合,將AgCuTi銲片與PbTe熱電材料接合,在520℃持溫60分鐘,發現AgCuTi銲片裡的Ti元素會與Te元素產生TeTi化合物,進而達成接合效果,但也發現Ag元素會有擴散到熱電材料之情形。利用複合銲片接合,填料為助銲劑、SnAg銲片、AlSi銲片與PbTe熱電材料接合,在320℃與580℃個別持溫20分鐘,有最佳的接合效果,在銲道裡沒有發現氣孔與裂痕,但銲道裡有銅元素散佈之情形,未來必須要再增加擴散阻障層,以阻擋銅擴散之情形。

    hermoelectric materials can be applied for converting heat energy directly to electric power. However, joining of thermoelectric material with electrode is a main challenge in constructing thermoelectric devices for the practical application. PbTe is regarded as one of the most likely materials working at intermediate temperature region. In this study, joining of PbTe thermoelectric materials and Cu electrode has been performed by changing different metal fillers, which were heated at elevated temperature and vacuum environment. The experiment results showed that the insertion of AgCuTi filler between PbTe and Cu can achieve effective joining at heating temperature of 520℃ and holding for 60 minutes. The compound of titanium and tellurium formed in the interface of joints which may promote the joining effect. However, diffusion of silver atoms to PbTe has been found, which may influence the thermoelectric properties of device. On the other hand, the use of flux/SnAg/AlSi fillers as incorporation can also attain effective joining at heating temperature of 320℃ and 580℃, which holding for 20 minutes respectively. There is no void and crack can be found in the interface of joints. However, the diffusion of copper atoms in the welding zone is a noteworthy problem.

    目錄 第一章 緒論 ---------------1 1.1 研究背景---------------3 1.2 研究動機與目的----------4 第二章 文獻回顧-------------5 2.1 熱電材料基本原理--------5 2.1.1 席貝克效應(Seebeck effect)---------5 2.1.2 佩提耳效應(Peltier effect) ---------5 2.1.3 湯姆森效應(Thomson effect) ---------6 2.2 熱電優值-----------------------------7 2.3 熱電元件構造--------------------------8 2.4 熱電材料種類與應用--------------------10 2.5 軟硬銲接合原理-----------------------15 2.6 熱電材料接合相關研究------------------17 2.6.1 火花電漿燒結(spark plasma sintering) ----------17 2.6.2 電阻銲接(resistance welding) -----------------19 2.6.3 薄膜沉積方法(thin film deposition method)------21 2.6.4 熱壓法(hot pressing method)-------------------23 2.6.5 電漿活化燒結(plasma activated sintering)-------25 第三章 實驗方法與步驟---------------------------------29 3.1 實驗規劃----------------------------------------30 3.2 實驗接合材料與設備--------------------------------31 3.3 實驗接合方法與流程--------------------------------36 3.4 金相顯微組織觀察----------------------------------38 3.5 掃描式電子顯微鏡觀察------------------------------39 3.6 電子微探儀分析(EPMA)-----------------------------40 3.7 感應偶和電漿質譜分析(ICPMS)-----------------------41 3.8 推力試驗----------------------------------------42 第四章 實驗結果與討論---------------------------------44 4.1 鍍膜接合實驗結果---------------------------------45 4.1.1 濺鍍 Mo 薄膜與銅電極接合------------------------45 4.1.2 蒸鍍 Cr、Cu 薄膜與銅電極接合--------------------46 4.2 銲片接合實驗結果---------------------------------48 4.2.1. AlSi 銲片與熱電材料接合-----------------------48 4.2.2 SnAg 銲片與熱電材料接合------------------------49 4.2.3 250μm SnAg銲片和AlSi 銲片與熱電材料接合---------51 4.2.4 150μm SnAg 銲片、AlSi 銲片與熱電材料接合--------52 4.2.5 SnAg 銲片和AlSi 銲片與熱電材料接合--------------53 4.2.6AgCuTi 銲片與熱電材料接合----------------------55 4.3 助銲劑、SnAg 銲片、AlSi 銲片---------------------70 4.3.1 助銲劑、SnAg 銲片、AlSi 銲片與熱電材料接合-------70 4.3.2 助銲劑、SnAg 銲片、AlSi 銲片與熱電材料接合之時效測試------72 4.4 推力測試----------------------------------------------80 4.5 低溫端接合--------------------------------------------82 4.7 實驗結果整理-------------------------------------------85 4.7.1 鍍膜接合--------------------------------------------85 4.7.2 銲片接合--------------------------------------------85 4.7.3 助銲劑、SnAg 銲片、AlSi 銲片接合-----------------------86 第五章 結論與未來展望----------------------------------------88 5.1 結論-------------------------------------------------88 5.2 未來展望-------------89 參考文獻-----------------90

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