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研究生: 張玟翔
Chang, Wen-Hsiang
論文名稱: 使用接觸式原子力顯微鏡在石墨烯/二硫化鉬異質結構上製造圖案化的光致螢光
Patterned Photoluminescence in Gr/MoS2 heterostructure using a contact mode atomic force microscope
指導教授: 林文欽
Lin, Wen-Chin
口試委員: 邱顯智 郭建成
口試日期: 2021/06/22
學位類別: 碩士
Master
系所名稱: 物理學系
Department of Physics
論文出版年: 2021
畢業學年度: 109
語文別: 中文
論文頁數: 62
中文關鍵詞: 石墨烯 /二硫化鉬異質結構接觸式原子力顯微鏡圖案化光致發光
英文關鍵詞: graphene/molybdenum disulfide heterostructure, contact mode AFM, patterned photoluminescence
研究方法: 實驗設計法
DOI URL: http://doi.org/10.6345/NTNU202100591
論文種類: 學術論文
相關次數: 點閱:138下載:9
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  • 不同二維材料的堆疊會引起光電特性的變化。然而,操縱圖案化的多層二維材料異質結構仍然具有挑戰性。因此,在這項研究中我們使用原子力顯微鏡對多層二維材料異質結構進行了圖案化處理,並進行表面形貌以及光致螢光的量測。應用不同的正向力大小,得以去除石墨烯上的殘留PMMA或是二硫化鉬上的石墨烯。當探針的正向力大小控制在110 nN ~ 200 nN的範圍內,可以有效清除石墨烯表面殘留的PMMA,使得表面粗糙度從平均15 nm下降至平均3 nm。當正向力大小介於200 nN與330 nN之間,石墨烯/二硫化鉬異質結構的石墨烯層會有破碎的現象,而在此範圍內其正向力與破碎程度呈現正相關。當正向力大小大於330 nN,石墨烯/二硫化鉬異質結構的絕大部分石墨烯層會被去除,僅殘存零星的石墨烯碎片。同時,石墨烯/二氧化矽上殘留了93%的石墨烯,這意味著二硫化鉬上的石墨烯比二氧化矽上的石墨烯相對容易刮除。而當正向力大小大於660 nN,可以完全去除石墨烯層並保留完整的二硫化鉬層。在轉移石墨烯之後,石墨烯/二硫化鉬異質結構的光致發光波長會有些微紅移的現象。在正向力摩擦之後的光致發光波長會相對於轉移石墨烯後有些許藍移的現象。在石墨烯/二硫化鉬異質結構上製造圖案,並透過光致發光光譜確認在裸露的二硫化鉬區域,其光致發光的光強度為石墨烯/二氧化矽區域的2倍。在表面電位分佈圖中也可以得到在圖案化的區域,表面電位與周圍石墨烯/二硫化鉬區域的電位差約為300 mV。從光學顯微鏡、原子力顯微鏡、拉曼光譜和光致發光光譜中,分別觀察到了PMMA和石墨烯的去除。我們已經成功地使用原子力顯微鏡來改變表面形貌以及圖案化的光致螢光,這將在未來激發更多有趣的研究或應用。

    The stacking of different 2D materials will cause the change of optoelectronic properties. However, it is still challenging to manipulate the microscopic patterns of multi-layer 2D material heterostructures. Therefore, in this study we used atomic force microscope (AFM) to reprocess multi-layer 2D material heterostructures to for the engineering of the surface and photoelectric properties. Applying different magnitudes of contact force can remove residual PMMA on graphene or graphene on molybdenum disulfide. When the contact force is controlled in the range of 110 nN ~ 200 nN, the PMMA remaining on the graphene surface can be effectively removed, so that the surface roughness will drop from an average of 15 nm to an average of 3 nm. When the contact force is between 200 nN and 330 nN, the graphene layer of the graphene/molybdenum disulfide heterostructure will be broken, and within this range, the contact force is positively correlated with the degree of breakage. When the contact force is greater than 330 nN, most of the graphene layer of the graphene/molybdenum disulfide heterostructure will be removed, leaving only sporadic graphene fragments. At the same time, 93% of the graphene remains on the graphene/silicon dioxide, which means that the graphene on the molybdenum disulfide is relatively easier to scrape off than the graphene on the silicon dioxide. When the positive force is greater than 660 nN, the graphene layer can be completely removed, and the molybdenum disulfide layer can remain intact. After the graphene is transferred, the photoluminescence wavelength of the graphene/molybdenum disulfide heterostructure will be slightly red-shifted. The photoluminescence wavelength after the action of the contact force will be slightly blue-shifted with respect to the graphene transferred. Patterns on the graphene/molybdenum disulfide heterostructure and confirm through photoluminescence spectroscopy that in the exposed molybdenum disulfide region, the photoluminescence intensity is 2 times that of the graphene/silicon dioxide region. In the surface potential distribution map, it can also be seen that in the patterned area, the potential difference between the surface potential and the surrounding graphene/molybdenum disulfide area is about 300 mV. From optical microscope, atomic force microscope, Raman spectroscopy and photoluminescence spectroscopy, the removal of PMMA and graphene was observed respectively. We have successfully used atomic force microscopy to change the surface topography and patterned photoluminescence, which will stimulate more interesting research or applications in the future.

    致謝 I 摘要 III Abstract IV 目錄 VI 圖目錄 VIII Chapter 1 序論 1 1.1 研究動機 1 1.2 二硫化鉬 (Molybdenum disulfide, MoS2) 2 1.3 石墨烯 (Graphene, Gr) 4 1.4 石墨烯/二硫化鉬異質結構 ( Gr-MoS2 heterostructure ) 5 Chapter 2 實驗儀器與操作原理 7 2.1 化學氣相沉積系統 ( Chemical Vapor Deposition ) 7 2.1.1 常壓化學氣相沉積 (Atmospheric-pressure CVD, APCVD) 7 2.1.2 低壓化學氣相沉積 (Low-pressure CVD, LPCVD) 7 2.1.3 超高真空化學氣相沉積 (Ultrahigh Vacuum CVD, UHVCVD) 7 2.2 原子力顯微鏡 (Atomic Force Microscopy, AFM) 9 2.2.1 接觸模式 (Contact Mode) 10 2.2.2 非接觸模式 (Non-contact Mode) 10 2.2.3 輕敲模式 (Tapping Mode) 10 2.2.4 力與距離曲線 (Force-Distance Curve) 12 2.2.5 峰值力輕敲模式 (PeakForce Tapping Mode) 14 2.2.6 克爾文探針力顯微鏡 (Kelvin probe force microscopy,KPFM) 15 2.2.7 探針彈性係數校正 (Spring constant calibration) 18 2.3 拉曼光譜系統 (Raman Spectra System) 19 2.3.1 拉曼光譜 (Raman Spectra) 19 2.3.2 光致發光 (Photoluminescence) 21 Chapter 3 實驗流程與步驟 22 3.1 樣品製備 ( Sample Preparation ) 22 3.1.1 成長二硫化鉬 (Growing Molybdenum Disulfide) 22 3.1.2 轉移石墨烯 (Graphene transfer) 24 3.2 樣品量測 ( Sample measurement ) 27 3.2.1 清除表面PMMA ( Remove PMMA from the surface ) 27 3.2.2 量測 – AFM ( Measurement -AFM ) 28 3.2.3 量測 – 拉曼光譜 ( Measurement -Raman Spectra ) 29 3.2.4 量測 – 光致發光 ( Measurement -Photoluminescence ) 30 3.2.5 量測 – 吸附力 ( Measurement - Adhesion force ) 32 3.2.6 量測 – KPFM ( Measurement -KPFM ) 33 Chapter 4 實驗數據結果與討論 34 4.1 不同正向力造成石墨烯在樣品表面上的破碎程度 34 4.1.1 正向力大小110 nN 36 4.1.2 正向力大小220 nN 37 4.1.3 正向力大小330 nN 39 4.1.4 正向力大小660 nN 41 4.1.5 110 nN、220 nN、330 nN、660 nN正向力摩擦後的光致發光 43 4.1.6 300 nN正向力對石墨烯/二硫化鉬上石墨烯破碎程度的影響 45 4.1.7 光學影像分析 51 4.2 製造圖案化的光致螢光 54 Chapter 5 結論 58 5.1 結論 ( Conclusion ) 58 參考文獻資料 60

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