研究生: |
林昇民 Sheng-Min Lin |
---|---|
論文名稱: |
非接觸式精微量測中心機之開發與應用 Development and application of a non-contact micro measurement center |
指導教授: |
陳順同
Chen, Shun-Tong |
學位類別: |
碩士 Master |
系所名稱: |
機電工程學系 Department of Mechatronic Engineering |
論文出版年: | 2010 |
畢業學年度: | 98 |
語文別: | 中文 |
論文頁數: | 110 |
中文關鍵詞: | 微細探針 、量測中心機 、微放電 、電容感測 、自動化光學檢測 |
英文關鍵詞: | micro probe, measurement center, micro EDM, capacitance sensing, automatic optical inspection (AOI) |
論文種類: | 學術論文 |
相關次數: | 點閱:128 下載:6 |
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本研究針對精微模具,開發一部非接觸式複合量測中心機。工件特徵尺度小於200 µm的精微模具,很難以現有的三次元接觸式量測機、雷射位移計或光學顯微鏡等傳統量測技術檢驗其精度,主要是量測面氧化層與深度打光問題難以克服之故。本研究突破傳統精微量測的微力接觸概念,自行研發一部精密三軸微型量測中心機,並以微放電技術進行線上微細探針製作。再利用機器視覺對量測部位進行影像快速擷取、二值化與辨識,所得圖像特徵用於導引微細探針,快速定位於圖像的特徵部位。藉由探針深入此特徵部位,如微細孔或窄縫中,透過電容式感測與頻譜訊號轉換,進行特徵部位的非接觸式幾何精度量測,由於探針保持非接觸狀態,故無量測力與氧化膜層問題,且線上製作微細探針,能針對工件的各種幾何形狀,迅速線上提供各種適用的探針,所以探針也無定位、夾持與校正所引發的精度問題。量測中心機之量測精度先以0級塊規校驗及比對,再對IC導線架精微模具上的陣列窄縫(100 µm),進行垂直精度的測試,所得精度值在量測系統的定位精度內,顯示本研究所開發的非接觸式精微量測技術,具有很高的量測精度與其可行性。
Many side walls of micro holes and slots are not easily measured by current measuring instruments, such as: coordinate measuring machine, laser displacement meter, or high magnification toolmaker microscope. It is very difficult for overcoming the oxide layer on the workpiece and lighting in the deep hole of the workpiece. A non-contact micro measurement center combining automatic optical inspection (AOI), micro EDM with capacitance sensing is designed and developed to automatically, precisely measure the perpendicularity of micro slot-wall on the precision mould. The measurement center can on-machine makes various micro probes to rapidly provide for the needed stylus in measurement. The AOI acquires the image from the feature profile of workpiece by way of the developed machine vision and perform the image binary to determine the centric position for guiding the movement of the micro probe. Capacitance sensing, by which a signal with very low voltage and high frequency is employed, is used for precisely measuring the slot-wall. To ensure the measuring accuracy, a ‘four steps feed’ strategy of the probe is proposed. The measuring data are converted to digital data, and then transferred into frequency domain from time domain via fast Fourier transform (FFT) to regulate the feed of the probe and record the positions. Owing to non-contact measurement, the measurement will not be affected even if the oxide layer exists on the workpiece. The measuring accuracy which the probe is first calibrated via the gauge block of grade-0 can be maintained within the positional accuracy of the measurement center and the working time decreased. A geometrical accuracy of narrow slot on the IC lead frame is successfully measured which demonstrates the developed measurement center possesses very high feasibility. It is expected that the techniques of measurement center will significantly contribute to the precision machining industry.
[1] Yamamoto M., Kanno I., Aoki S., “Profile measurement of high aspect ratio micro structures using a tungsten carbide micro cantilever coated with PZT thin films,” Proceedings of the IEEE Micro Electro Mechanical Systems, 2000, pp. 217~222
[2] Masuzawa T., Fujino M. and Kobayashi K.,” Wire-electro discharge grinding Method”, Annual CIRP , Vol.34, 1985, pp. 431~434
[3] Kim B., Masuzawa T., Bourouina T.,” The vibroscanning method for the measurement of micro-hole profiles,” Measurement Science and Technology, Vol.10, 1999, pp.697~705
[4] Kim B., Sawamoto Y., Masuzawa T., Fujino M., “Advanced vibroscanning method for microhole measurement - height speed and stability improvement of measurement technique ,”International Journal of Electrical Machining, No. 1, 1996, pp. 41~44
[5] Masuzawa, T., Hamasaki, Y., Fujino, M., “Vibroscanning Method for Nondestructive Measurement of Small Holes,” Annual CIRP, Vol.42, 1993,pp. 589~592
[6] Masuzawa T., Kim B., Bergaud C., Fujino M. , “Twin-probe vibroscanning method for dimensional measurement of micro holes,” Annals of the CIRP,Vol. 46/1, 1997,pp. 437~440
[7] Kim B., Masuzawa T. , Fujita H., Tominaga A., “Dimensional measurement of micro holes with silicon-based micro twin probes,” Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS), 1998, pp. 334~339
[8] Yang S., Li S., Kaiser M., Kwun F., “A probe for the measurement of diameter and form errors of small holes,” Measurement Science and Technology, Vol. 9, No. 9, 1998, pp. 1365~1368
[9] Yamamoto M., Takeuchi H., Aoki S., “Dimensional measurement of high aspect ratio micro structures with a resonating micro cantilever probe,”Microsystem Technologies, Vol. 6, No. 5, 2000, pp. 179~183
[10] Lebrasseur E., Pourciel J., Bourouina T., Masuzawa T., Fujita H., “A new characterization tool for vertical profile measurement of high-aspect-ratio microstructures,” Journal of Micromechanics and Micro Engineering,
Vol. 12, No. 3, 2002, pp. 280~285
[11] Pourciel J.B.., Jalabert L., Masuzawa T., “SDAPPLIN, a method for 2D profiling on high aspect ratio microstructures. Improvement for 3D surfacing,” Proceedings of the 30th SEIKEN Symposium on Micro/Nano
Mechatronics, Japan, March 25~26, 2002, pp.136~138
[12] Pourciel J.B., Jalabert L., Masuzawa T., “Profile and surface measurement tool for high aspect-ratio microstructures,” JSME International Journal, Series C: Mechanical Systems, Machine Elements and Manufacturing, Vol.46, No. 3, 2003, pp. 916~922
[13] Mitutoyo Vision & Optical System Group, The UMAP Vision System, http://www.mitutoyo.co.jp/eng/news/newsfile/02data/02_13.html as it is in 10/2003
[14] Oiwa T., Nishitani H., “Three-dimensional touch probe using three fiber optic displacement sensors,” Measurement Science and Technology , Vol.15, 2004, pp. 84~90
[15] Oiwa T., Tanaka T., “Miniaturized three-dimensional touch trigger probe using optical fiber bundle,” Measurement Science and Technology, Vol.16, 2005,
pp. 1574~1581
[15] Oiwa T., Tanaka T., “Miniaturized three-dimensional touch trigger probe using optical fiber bundle,” Measurement Science and Technology, Vol.16, 2005,
pp. 1574~1581
[16] Muralikrishnan B., Stone J. A., Stoup J. R., “Fiber deflection probe for small hole metrology,” Precision Engineering, 2005
[17] 陳順同,微CNC綜合加工機研發與微元件製造研究,博士論文,國立台灣大學機械工程學研究所,2005
[18] 吳秉翰,微元件內部垂直輪廓量測系統之研究, 碩士論文,國立台灣大學機械工程學研究所,2005
[19] Meli F., Kueng A., Thalmann R., “Ultra precision micro-CMM using a low force 3D touch probe, Proceedings of SPIE,” Conf. on Recent Developments in Traceable Dimensional Measurements III, Vol. 5879, 2005, pp. 240~247
[20] Neville K. S. Lee, Jacky K. H. Chow, Albert C. K. Chan, “Design of precision measurement system for metallic hole,” International Journal Of Advanced Manufacturing Technology, Vol. 44, 2009, pp. 539~547
[21] 黃洽士,閉迴路自動化微電極加工系統之研究,碩士論文,國立雲林科技大學,機械工程研究所,2000
[22] 游國清,LCD組裝製程之影像定位系統研究,碩士論文,國立逢甲大學,自動控制工程研究所,2002
[23] Sotiris M., Michael G. S., ”Stereo vision system for precision dimensional inspection of 3D holes,” Machine Vision and Applications, Vol. 15, 2003, pp. 101~113
[24] 廖運炫,「放電加工之發展趨勢與研究現況」,機械月刊,Vol. 301,2000,pp. 374~387
[25] Reference manual, Charmilles technologies robfil 300, 1993, p1.1.4~p1.1.5
[26] Bilbao, SPAIN, Proceedings of the 13th International Symposium for electro-machining isem XIII, May 9th-11th, 2001, page 4
[27] 機械技術雜誌編輯部,二十一世紀的顯學微機電系統(四)-微放電精密加工,機械技術雜誌,2000,pp.220~222
[28] Y. S. Liao, S. T. Chen and C. S. Lin, “Development of A Multi-function High Precision Tabletop CNC Machine for Making Micro Parts,” Proceedings of the LEM 21, International Conference on Leading Edge Manufacturing in 21st Century Oct. 19-22, Nagoya, Japan, 2005, pp. 485~490 (LEM21 The Best Paper Award)
[29] 葉昭蘭,「機械視覺技術回顧與展望」,機械工業雜誌,第二一一期, 民國89年10月,第160~185頁
[30] Moganti M., Ercal F., ”Automatic PCB inspection system,” Potentials, IEEE, Vol. 14, NO. 3, 1995, pp. 6~10
[31] Moganti M., Ercal F., ”Automatic PCB inspection Algorithms: A Survey,” Computer Vision and Image Understanding, Vol. 63, NO. 2, 1996, pp. 287~313
[32] Coletti G., Tool J. C. and Geerligs J. L., ”Mechanical Strength of Silicon Wafer and its Modeling,” in 15th Workshop on Crystalline Silicon Solar Cells and Modules Materials and Processes, Colorado, USA, Aug. 7-10, 2005, pp. 117~120
[33] Park K. Y., Wagener C. M., Stoddard N., Bennett M. and Rozgonyi A. G., “Correlation Between Wafer Fracture and Saw Damage Introduced During Cast Silicon Cutting,” In : 15th Workshop on Crystalline Silicon Solar Cells and Modules : Materials and Processes, Colorado, USA, Aug. 7-10, 2005, pp. 178~181
[34] Rafael C. Gonzalez, Richard E. Woods, Digital image processing,Third Edition , 2008, pp. 36~37
[35] Nello Zuech., Applying Machine Vision , Wiley New York, 1988, pp.45-66
[36] 王瑞陽,「機器視覺系統的光源與照明」,機械工業雜誌,第66期,民國77年9月,第185~200頁
[37] Bancroft K. 原著,吳佳鎮譯,鏡頭淺談,台北市,眾文圖書公司,民國74年,第20~70頁
[38] Bigas M., Cabruja E., Forest J.,and Salvi J., “Review of CMOS image sensors,” Microelectronics Journal, Vol.37, 2006, pp. 433~451
[39] Nian Y. C., Chuang F. S.,and Tarng S. Y., “A new algorithm for a three-axis auto-alignment system using vision inspection,” JMPT, 2006
[40] Lewis J. P., ”Fast normalized cross-correlation, ”Vision Interface, 1995, pp. 120~123
[41] Friemel B. H., Bohs L. N., and Trahey G. E., ”Relative performance of two-dimensional speckle-tracking techniques: normalized correlation, non-normalized correlation and sum-absolute-difference,” Proc. of IEEE Ultrasonics Symposium, Vol. 2, 1995, pp. 1481~1484
[42] Briechle K., Hanebeck U. D., ”Self-localization of a mobile robot using normalized cross correlation,” Proc. of IEEE International SMC Conference, Vol. 4, 1999, pp. 720~725
[43] Zhang J. W., D. Li, Ye F. and Sun. H. ,”Automatic optical defect inspection and dimension measurement of drill bit,” ICMA 2006-IEEE International Conference on Mechatronics and Automation, 2006, pp. 95~100
[44] 維基百科全書網站,電容器原理,http://zh.wikipedia.org/
[45] 蒙文舜、楊運經、劉雲鵬,電容傳感器的原理與應用,2003
[46] Baxter L. K., Capacitive sensors - design and application, IEEE Press, 1997, pp. 38~212
[47] 佐藤幸男、雨宮好文,圖解訊號處理入門,建興文化事業有限公司,2007,第145~177頁
[48] 范光照、張郭益,精密量測,高立圖書有限公司,2004,第189-191頁
[49] Davis, J. R., ASM Specialty Handbook, Tool Materials, ASM International, Materials Park, OH 440730002, 1995,
pp. 88
[50] Jian-hai H., Shu-shang Z., Wei-Robotics S., " Research on Sub-pixel Detecting on-line System Based on Machine Vision for Inner Diameter of Bearings ," IEEE International Conference on Robotics and Biomimetics, Dec. 15-18, 2007, pp. 2049 ~2052