研究生: |
賴運正 Yun-Cheng Lai |
---|---|
論文名稱: |
精微超硬研削工具線上開發與應用 On-line development and application of the micro super grinding tools |
指導教授: |
陳順同
Chen, Shun-Tong |
學位類別: |
碩士 Master |
系所名稱: |
機電工程學系 Department of Mechatronic Engineering |
論文出版年: | 2010 |
畢業學年度: | 98 |
語文別: | 中文 |
論文頁數: | 96 |
中文關鍵詞: | CBN陣列式輪刀 、微型鑽石磨棒 、微放電成型 、電化學複合沉積 |
英文關鍵詞: | CBN wheel tool array, rod-shaped diamond grinding tool, micro EDT, electrochemical co-deposition |
論文種類: | 學術論文 |
相關次數: | 點閱:165 下載:12 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本研究旨在開發超硬微型研磨工具,提供微型模具的線上精研加工,並以低成本及陣列式開發,專用於脆性材料如細胞檢測之載玻片微溝加工、陶瓷光纖接頭的去角加工或模具材料如NAK80模具鋼的微溝加工等。研究中,提出一種複合製造技術,結合『精密複合沉積』與『微型線切割放電加工』,將粒徑0-2µm的鑽石或立方晶氮化硼(CBN)顆粒以電化學複合沉積方式沉積於基材上,而成特定形狀的微細鑽石(或立方晶氮化硼)工具。微細工具粗胚以高速主軸夾持,再以線切割放電加工方式,將之線上削正成型,完成的精微研削工具不拆卸,直接透由CNC刀具路徑移位至工件處,進行微細研削加工。由於本技術採線上複合式製造,故刀具沒有定位問題,可獲致製程之高同心度與高定位精度。刀具具『精微』與『超硬』外,製程所需費用低、環保、成型速度快、加工精度高,加工的工件更能獲致『精密快速』效果。
The major aim of the thesis is to develop the micro cubic boron nitride (CBN) wheel tool array and rod-shaped diamond grinding tool for generating the micro grooves array on the optical glass and mould steel of NAK80, and chamfering at the edge of micro ceramic ferrule, respectively. A hybrid fabrication technique combining precise co-deposition with micro w-EDT is used to the process development. The tool blank is first fabricated through micro EDM and composite electroforming process so that the super abrasives, which includes cubic boron nitride (CBN) and diamonds with grain size of 0-2 µm, are uniform deposited onto the cylindrical substrate that made of aluminum alloy or tungsten carbide for producing a miniature multilayered grinding tool. Nickel, diamond and CBN play the role of binder and cutter, respectively. Some fabrication strategies including the partition plate for improving the convection in the electroforming solution, a miniature funnel mould enables the abrasives to converge toward the cathode to increase their deposition probability on the substrate, are designed and proposed. The dispersion of abrasive grains and displacement of nickel ions are noticeably made better. A non-continuous substrate design is proved that the current crowding effect is able to be restricted validly, thereby improving their distribution on the substrate surface. The finished wheel tool blank is clamped on a high speed spindle and formed into disk-shaped tool array with 10-µm for the thickness of each piece by means of micro w-EDT process. The miniature diamond grinding tool usable with the outside diameter of 100-µm for the precise micro grinding of miniature parts is also presented. They are individually directly used in grinding the workpiece using the ‘high-speed and fast-shallow grinding’ technique, with which a very high grinding velocity and very shallow grinding depth are employed, is used for precisely machining the microgrooves. The microgrooves with a checkerboard-like layout on optical glass and NAK80 mould steel are successfully fabricated for the application of cells counter. Also, a micro ZrO2 ceramic ferrule is finely chamfered at the edge of the inner hole by the developed tapered grinding tool so that the fiber easily passes through it. High dimensional and geometrical accuracy can be achieved with this hybrid technique. Further, the proposed technique is rapid, cost effective, environment friendly and easily controllable.
1.謝慶堂等人,工業材料雜誌,193期,pp. 175,民92。
2.詹前疆,產業調查與技術,微機電系統,pp. 87-102,民90。
3.J. S. Lee, D. W. Lee, Y. H. Jung, W. S. Chung, "Brittle–ductile transition in the diamond cutting of glasses with the aid of ultrasonic vibration", Journal of Materials Processing Technology, Vol. 121, pp. 243-251, 2002
4.K. Matsumaru, A. Takata, K. Ishizaki, "Advanced thin dicing blade for sapphire substrate", Science and Technology of Advanced Materials, Vol. 6, pp. 120-122, 2005
5.I. H. Cho, S. C. Jeong, J. M. Park, H. D. Jeong, "The application of micro-groove machining for the mold of PDP barrier ribs", Journal of Materials Processing Technology, Vol. 113, pp. 355-359, 2001
6.S. B. Lee, Y. Tani, T. Enomoto, H. Sato, "Development of a dicing blade with photopolymerizable resins for improving machinability", CIRP Annals Manufacturing Technology, Vol. 54, pp. 293-296, 2005
7.J. S. Lee, D. W. Lee, Y. H. Jung, W. S. Chung, "Brittle–ductile transition in the diamond cutting of glasses with the aid of ultrasonic vibration", Journal of Materials Processing Technology, Vol.121, pp.243–251, 2002
8.楊啟榮,強玲英,黃奇聲,微系統LIGA製程之精密電鑄技術,科儀新知,pp. 22,民89。
9.J. Y. Cheng, C. W. Wei, K. H. Hsu, T. H. Young, Direct-write laser micromachining and universal surface modification of PMMA for device development, Sensors and Actuators B: Chemical Vol. 99, pp.186-196, 2004
10.Th. Schaller, L. Bohn, J. Mayer, K. Schubert, "Microstructure Grooves With A Width of Less than 50μm Cut With Ground Metal Micro End Mills", Precision Engineering, Vol. 23, pp. 229-235, 1999
11.C. L. Kuo, J. D. Huang, “Fabrication of series-pattern micro multi-disk and its application to cut micro slit with width as low 10μm”, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education, Vol.27, pp.154-156, 2002
12.陳?東,以線放電加工在微細槽模具製程探討,博士論文,國立中興大學,機械工程學系,2004,pp.69-79
13.S. Nikumba, Q. Chen, C. Li, H. Reshef, H. Y. Zheng, H. Qiu, D. Low, "Precision glass machining, drilling and profile cutting by short pulse lasers", ELVEIER, pp. 216-221, 2005
14.B. H. Kim, C. W. Na, Y. S. Lee, D. K. Choi, C. N. Chu, "Micro Electrochemical Machining of 3D Micro Structure Using Dilute Sulfuric Acid", CIRP Annals - Manufacturing Technology, Vol. 54, pp. 191-194, 2005
15.G. D. Kim, B. G. Loh, "An ultrasonic elliptical vibration cutting device for micro V-groove machining: Kinematical analysis and micro V-groove machining characteristics", Journal of Materials Processing Technology, Vol. 190, pp. 181-188, 2007
16.C. Evans, "Cryogenic Diamond Turning of Stainless Steel", Annals of the CIRP, Vol.40, pp.571-575, 1991
17.S. Sano, W. Pan, M. Iwai, S. Ninomiya, T. Uematsu, K. Suzuki, "Hybrid processing of EDM and grinding with an ED-T-formed PCD tool", ISAAT, Dearborn, Michigan, USA, 2007
18.S. T. Chen, C. C. Liu, Y. C. Lai, Y. L. Pai, "Development of Micro Formed Grinding Tool using Compound Processes", Proceedings of the 24th National Conference on Mechanical Engineering, Chung-Li, Taiwan, pp. 4687-4692, 2007
19.J. C. Hung, W. C. Wu, B. H. Yan, F. Y. Huang, K. L.Wu, "Fabrication of a micro-tool in micro-EDM combined with co-deposited Ni–SiC composites for micro-hole machining", J. Micromech. Microeng, Vol. 17, pp. 763-774, 2007
20.S. T. Chen, M. C. Yeh, "Development and application of a micro-honing-tool", Advanced Materials Research, Vols. 76-78, pp. 189-194, 2009
21.J. C. Aurich, J. Engmann, G. M. Schueler, R. Haberland, "Micro grinding tool for manufacture of complex structures in brittle materials", CIRP Annals - Manufacturing Technology, Vol. 58, pp. 311-314, 2009
22.Hewitson, "Eastman Kodak Co". Vol. 1, pp. 627-900, 1927
23.Straumanis, M. E. Brakss, J. Electrochem. Soc., pp. 95-98, 1949
24.Streicher, J. Electrochem. Soc., pp. 96-170, 1949
25.Petrocelli, J. Electrochem. Soc., pp. 98-183, 1951
26.呂政?編,電鍍學,世一書局,pp. 10,民82。
27.蘇癸陽編,實用電鍍理論與實際,復文出版社,pp. 96-98,民88。
28.陳順同、林憲志,超薄型鑽石輪刀開發與光學玻璃細溝加工研究,模具暨應用產業技術論文發表會論文集,南港世貿館,pp. 281-289,2009。
29.楊啟榮,微機電製程之精密電鑄技術。http://mems.ie.ntnu.edu.tw
30.張義和、徐敬添、鄒淑貞、陳守一、時國誠,微奈米粉體用高分子型分散劑,化工技術,第十一卷,第十一期,pp. 118-125,民92。
31.廖運炫,放電加工之發展趨勢與研究現況,機械月刊,Vol. 301,pp. 374-387。
32.Charmilles technologies ROBOFIL 300, pp. 1.1.4-1.1.5, 1993
33.Bilbao, SPAIN, Proceedings of the 13th International Symposium for electromachining isem XIII, May 9th-11th, pp.4, 2001
34.機械技術雜誌編輯部,二十一世紀的顯學微機電系統(四)-微放電精密加工,機械技術雜誌,pp. 220-222,民89。
35.Masuzawa T., Fujino M., "Wire Electro Discharge Grinding for Micro Machining", CIRP, Vol. 34, pp.431-434, 1985
36.庄司克雄, 超精密加工?非球面加工, NTS, ISBN4-8043-059-X C3050, 民93。
37.James M. Gere, Stephen P. Timoshenko, Mechanics of Materials, Boston PWS, H4, 1984
38.張義和、徐敬添、鄒淑貞、陳守一、時國誠,微奈米粉體用高分子型分散劑,化工技術,第十一卷,第十一期,pp. 118-125,民92。
39.松祿文化機械群編譯,精密鑽石工具,松祿文化事業,pp. 130,民91。
40.王秦生,超硬材料電鍍制品,中國磨料磨具工業公司,pp. 11,民89。
41.C. H. Huang, "Hydrolysis of Sulfamate Ion in Nickel Sulfamate Solution", Plating and Surface Finishing, pp. 64-68, 1994
42.Davis, J. R., "ASM Specialty Handbook, Tool Materials", ASM International, Materials Park, OH 440730002, pp.88, 1995
43.Y. Chen, L. C. Zhang, J. A. Arsecularatne, "Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism", International Journal of Machine Tools & Manufacture, pp. 1615-1624, 2007
44.宋健民,超硬材料,全華科技圖書股份有限公司,pp. 5-2,民89。
45.千盟模具有限公司,http://www.taissic.com/uwish/front/bin/home.phtml
46.郭鴻賓,玻璃工程,徐氏基金會出版,pp. 6-9,民59。
47.天文大同特殊鋼股份有限公司,http://www.daidosteel.com.tw
48.Y. S. Liao, S. T. Chen, Development of a high precision tabletop versatile CNC wire-EDM for making intricate- micro parts, Journal of Micromechanics and Microengineering, P246-249, 2005
49.林憲志,厚度10μm鑽石輪刀開發與光學玻璃切溝研究,國立台灣師範大學工業教育學系,博士論文。
50.Milton C. Shaw, "Metal cutting principles", pp. 179-184, 2005
51.Huang H, Chen W K, Yin L, Xiong Z, Liu Y C and Teo P L, "Micro/meso ultra precision grinding of fibre optic connectors Precis", Vol. 28, pp. 95-105, 2004