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研究生： 陳建智
Chen, Chien-Chih
論文名稱： 避熱式旋轉放電法於針尖1-μm之單晶鑽石探針高效成形研究
Efficient formation of a monocrystalline diamond probe with 1-µm tip-radius by using heat-prevented RWEDM approach
指導教授： 陳順同
Chen, Shun-Tong
學位類別： 碩士
Master
系所名稱： 機電工程學系
Department of Mechatronic Engineering
論文出版年： 2018
畢業學年度： 106
語文別： 中文
論文頁數： 160
中文關鍵詞： 含硼單晶鑽石 、單晶鑽石探針 、避熱式旋轉放電法 、表面粗糙度
英文關鍵詞： Boron-doped monocrystalline diamond (BD-MCD), heat-prevented rotation wire electrical discharge machining, surface roughness, monocrystalline diamond probe
DOI URL： http://doi.org/10.6345/THE.NTNU.DME.012.2018.E08
論文種類： 學術論文
相關次數： 點閱：105  下載：2 
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    • 本研究旨在針對「針尖圓弧半徑1 µm」的單晶鑽石探針，進行快速研磨成形研究。為獲得高效能的單晶鑽石探針之成形加工，研究提出一種「避熱式旋轉放電法(Heat-prevented rotation wire electrical discharge machining, Heat-prevented RWEDM)」，透由避熱路徑演算法，計算出銅線放電加工的最佳路徑，以便對真空焊接(Vacuum brazing)完成的含硼單晶鑽石(Boron-doped monocrystalline diamond, BD-MCD)進行旋轉式放電。高溫火花熔蝕可無視於鑽石的硬度，探針能被快速旋轉熔蝕至針尖10 µm的雛形，除了可移除鑽石與基材的大部分材料外，更可避免鑽石因高熱而脫離母材，著實能大幅減少後續的研磨加工時間。高溫亦可使探針表面由sp3的鑽石結構降至sp2的石墨化層結構，有利於後續研磨過程中的潤滑。完成的鑽石探針雛型，續以陶瓷結合劑鑽石磨輪進行切線式的粗加工、精加工研光及拋光。實驗發現，於研磨的最終階段，添加#14,000超微磨粒，並以進給深度0.1 µm/stroke進行精拋光，可使鑽石探針針尖半徑達1.0 µm，表面粗糙度達Ra86 nm，全程耗時僅2小時36分鐘。比起傳統僅以研磨方式成形，效率提高54%。最後由表面粗糙度量測儀對成形的鑽石探針進行量測驗證，證實本製品的量測結果能達JIS 2001規範的標準差範圍，顯示本研究所開發的單晶鑽石探針能應用於商用的表面粗糙度量測儀的量測，研究所提方法具「技術自主」及「商業化」價值。

    This study presents the development of a high-performance hybrid process technique for making an industrial monocrystalline diamond (MCD) probe with 1-μm tip-radius. To realize high-performance formation of MCD probe, a heat-prevented rotation wire electrical discharge machining (RWEDM), by which an optimum CNC path of wire-cutting is schemed via the designed heat-prevent algorithm, is proposed to swiftly erode the boron-doped monocrystalline diamond (BD-MCD) in this study. Regardless of the hardness of workpiece, the diamond probe prototype with 10-μm at tip-radius can be speedily formed by the high-energy spark of temperature. The diamond blank separated from the substrate due to an unduly high discharge heat would not has happened. Besides which, it can remove most of material decreasing substantially the time of consequent grinding process. The high-temperature of spark erosion greatly facilitates the SP3 diamond bond structure into SP2 graphite structure, which is helpful in the effect of lubrication during grinding process. Tangential lapping and polishing are conducted, respectively by a vitrified bond diamond grinding wheel after the diamond probe prototype formed. Experimental results show that the monocrystalline diamond (MCD) probe with 1-μm tip-radius and surface roughness of Ra86 nm can be achieved when combining the grinding depth of 0.1 µm/stroke with ultra-fine abrasives of #14,000. It also demonstrates that total processing time is only 2 hours and 36 minutes, which the machining efficiency has evidently increased by 54% compared with that only using conventional grinding method. The finished diamond probe has been confirmed by a commercial surface roughness measuring instrument and proved that the range of errors fully fall into the JIS 2001 standard. It indicates that the developed monocrystalline diamond probe can been employed as a commercial probe for servicing in the surface roughness measuring. It is expected that the hybrid process technique will significantly contribute to the high-precision industry and to future micro fabrication techniques.

    摘要 ii Abstract iii 誌謝 iv 目錄 v 表目錄 ix 圖目錄 xii 符號說明 xvi 第一章 緒論 1 1.1 前言 1 1.2 文獻回顧 3 1.2.1 含硼單晶鑽石特性 4 1.2.2 鑽石加工及應用 7 1.2.3 鑽石探針的形成 19 1.3 研究動機 21 1.4 研究目的 21 1.5 研究方法 23 第二章 實驗原理 25 2.1 單晶鑽石之成形 25 2.2 含硼單晶鑽石之成形 27 2.3 單晶鑽石方向性 30 2.4 鑽石焊接原理 32 2.5 放電誘導石墨化原理 35 2.5.1 精微放電加工原理(RC電路) 35 2.5.2 精微放電加工原理(電晶體電路) 36 2.5.3 鑽石石墨化過程 38 2.6 研磨原理 40 2.7 平台伺服系統控制與訊號回饋 41 第三章 實驗設備 43 3.1 CNC線切割放電加工機 43 3.2 CNC立式綜合加工機 43 3.3 高速主軸 44 3.3.1 滾珠軸承高速主軸 44 3.3.2 氣浮軸承高速主軸 45 3.4 高速資料擷取(DAQ)模組 46 3.5 真空焊接爐 47 3.6 工具顯微鏡 47 3.7 掃描式電子顯微鏡 48 3.8 拉曼光譜儀 48 3.9 雷射共軛焦顯微鏡 49 3.10 實驗材料 50 3.10.1 不銹鋼基材 50 3.10.2 銅線電極 50 3.10.3 陶瓷結合劑磨輪 51 3.10.4 鑄鐵盤 51 第四章 實驗方法 53 4.1超精微研削系統設計 54 4.1.1 線上旋轉式火花熔蝕倒置機構設計 55 4.1.2 磁吸機構及緩衝機構設計 57 4.1.3 雙主軸切線研削機構設計 58 4.1.4 鑄鐵磨盤設計 60 4.1.5 人機介面設計 62 4.2 放電誘導石墨化實驗 63 4.2.1 RC放電能量對材料移除速率影響 63 4.2.2 電晶體放電迴路加工對材料移除速率的影響 67 4.2.2.1 電晶體放電作用時間(Current on time, τon)對焊料的影響 68 4.2.2.2 電晶體放電休止時間(Current off time, τoff)對焊料的影響 71 4.2.2.3 直線式加工路徑之針尖直徑(wd)對焊料的影響 76 4.2.3 電晶體迴路避熱式加工路徑規劃 80 4.2.3.1 避熱路徑演算法 81 4.2.3.2 避熱式加工路徑之安全距離(ws)對焊料的影響 83 4.2.3.3 避熱式加工路徑之安全高度(hd)對焊料的影響 88 4.2.4 最佳化之避熱路徑演算法 92 4.2.4.1避熱式加工路徑之針尖直徑(wd)對焊料的影響 97 4.2.4.2 電晶體放電伺服電壓(Servo voltage, SV)對焊料的影響 104 4.2.4.3 電晶體放電沖流參數(Flushing)對焊料的影響 108 4.2.5 電晶體放電能量對鑽石表面石墨化影響 113 4.2.6 電晶體放電對含硼單晶鑽石火花熔蝕能力探討 116 第五章 研磨實驗 119 5.1 切線式研削實驗規劃 119 5.1.1 切線式研削法 119 5.1.2 研削速度之實驗規劃 122 5.2 含硼單晶鑽石探針研削實驗 126 5.2.1 鑽石探針粗加工之研削實驗 126 5.2.2 鑽石探針精加工之研光實驗 128 5.2.3 鑽石探針精加工之拋光實驗 130 5.2.4 磨輪添加超微磨粒對鑽石針尖半徑的影響 133 5.3 磨輪與鑄鐵盤之填塞探討 135 第六章 實驗驗證 139 6.1 鑽石探針表面形貌及表面粗糙度量測 139 6.2 表面粗糙度量測驗證 141 第七章 結論 143 7.1 研究成果與貢獻 143 7.1.1本研究成果 143 7.1.2 本研究貢獻 144 7.2 未來展望 145 參考文獻 147 附錄 155

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