研究生: |
温鎮豪 Wen, Chen-Hao |
---|---|
論文名稱: |
氧化鋁基覆蓋層應用於氧化鋁鉿鐵電記憶體與電晶體之製程整合與元件電性探討 Process Integration and Electrical Characteristics Investigation of Hafnium- Aluminum Oxide Ferroelectric Memories and Transistors Using Aluminum-Oxide-Based Capping Layer |
指導教授: |
鄭淳護
Cheng, Chun-Hu |
口試委員: |
高瑄苓
Kao, Hsuan-Ling 黃靖謙 Huang, Ching-Chien 鄭淳護 Cheng, Chun-Hu |
口試日期: | 2023/07/26 |
學位類別: |
碩士 Master |
系所名稱: |
機電工程學系 Department of Mechatronic Engineering |
論文出版年: | 2023 |
畢業學年度: | 111 |
語文別: | 中文 |
論文頁數: | 87 |
中文關鍵詞: | 鐵電記憶體 、鐵電場效電晶體 、氧化鋁鉿覆蓋層 、氧化鋁覆蓋層 |
英文關鍵詞: | ferroelectric memory, ferroelectric field-effect transistor, HfAlO capping layer, Al2O3 capping layer |
研究方法: | 實驗設計法 |
DOI URL: | http://doi.org/10.6345/NTNU202301361 |
論文種類: | 學術論文 |
相關次數: | 點閱:149 下載:6 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本研究探討單層氧化鋁與不同沉積比的氧化鋁鉿材料於氧化鋁鉿鐵電電容元件之覆蓋層效應,以及比較不同製程條件下之鐵電電容和電晶體特性。在實驗上,我們製備四種條件鐵電電容,使用純氧化鋁覆蓋層與三種不同沉積比的氧化鋁鉿覆蓋層應用於氧化鋁鉿鐵電電容,並於實驗完成後進行電容和電晶體元件電性量測。
從實驗結果發現,純氧化鋁覆蓋層能增強氧化鋁鉿鐵電電容的鐵電極化特性,相比於採用氧化鋁鉿覆蓋層,在低量測電壓3.0V下,也有最優異的鐵電極化特性,兩倍殘餘極化值為16 μC/cm2,以及最佳的電荷儲存能力,在100 kHz的操作頻率下,電容值為381 pF,同時能抑制漏電流 約1個數量級。在元件耐久度方面,在量測電壓為±4.0 V條件下,經過4.5×107個循環後仍能保有16 μC/cm2的兩倍殘餘極化量,其鐵電記憶體能具有較佳的儲存性能與更低的功耗表現。而鐵電電容元件採用氧化鋁鉿覆蓋層,則是在低電壓下能些微增強氧化鋁鉿鐵電電容鐵電極化特性,但是將電壓加大後,反而降低氧化鋁鉿鐵電電容鐵電極化特性。此不理想鐵電效應推測是與三元氧化鋁鉿覆蓋熱穩定性不佳,容易在退火過程產生過多界面缺陷有關。在類神經方面,純氧化鋁覆蓋層條件與氧化鋁鉿覆蓋層條件的非線性度皆小於1,其中純氧化鋁覆蓋層條件與沉積比1:9的氧化鋁鉿覆蓋層條件分別為0.58、0.51,更適合應用於類神經網路架構。在鐵電場效電晶體部分,相較於氧化鋁鉿覆蓋層條件,純氧化鋁覆蓋層之鐵電場效電晶體擁有較佳的開關特性,其最小次臨界擺幅為79 mV/decade、開關電流比為1.9 x105,以及響應速度也較優異,轉導值 為7.6 x10-5 mS。
In this study, we investigated the capping layer effect of hafnium-aluminum oxide (HfAlO) ferroelectric capacitors using Al2O3 and HfAlO capping materials. The related electrical characteristics of ferroelectric capacitors and transistors (FeFET) with different process conditions were also carried out. In the experiment, we fabricated HfAlO ferroelectric devices with four conditions of capping layers. The capping layer conditions included a single-layer Al2O3 capping layer and three HfAlO capping layers with different deposition ratios. After device fabrication, we performed the electrical characteristic measurements of capacitor and transistor.
According to the experimental results, we found that the pure Al2O3 capping layer favorably enhanced the ferroelectric polarization characteristics of HfAlO ferroelectric capacitor. The excellent remanent polarization of about 16 μC/cm2 can be obtained at a low measurement voltage of 3.0V. The capacitance can reach to 381 pf at an operating frequency of 100 kHz, which had a good charge storage capacity. The leakage current of 8.8×10-9 A can be measured at a voltage of -3.5 V., The leakage current can be suppressed by an order of magnitude after adopting an Al2O3 capping layer. From the endurance test, the HfAlO ferroelectric capacitor using Al2O3 capping layer stably switched at an operating voltage of ±4.0V, and the remanent polarization of 16 μC/cm2 can be maintained after 4.5×107 cycles. It showed well-controlled ferroelectric polarization characteristics and better storage performance under the operation of low power consumption. On the other hand, HfAlO capping layer can slightly enhance the ferroelectric polarization characteristics of HfAlO ferroelectric capacitor at low voltage, but reduce ferroelectric polarization characteristics at high voltage. The nonideal ferroelectric polarization effect can be ascribed to the poor thermally-stable ternary material structure of HfAlO capping layer, which easily generate interface defects during the annealing process. In Artificial Neural Network (ANN) analysis, the non-linearity values of HfAlO ferroelectric capacitors using Al2O3 capping layer and HfAlO capping layer were less than 1. The non-linearity values of samples using Al2O3 capping layer and HfAlO capping layer with specific deposition ratio of 1:9 were 0.58 and 0.51, respectively, which was more suitable for ANN. Compared to the FeFET using HfAlO capping layer, the FeFET using Al2O3 capping layer showed better switching characteristic and faster response speed. The lowest subthreshold swing was about 79 mV/decade and the switching on/off current ratio can reach to 1.9x105. Besides, the transconductance was close to 7.6 x10-5 mS, which was also higher than that of FeFET with HfAlO capping layer.
II Arikpo, FU Ogban, and IE Eteng, "Von neumann architecture and modern computers," Global Journal of Mathematical Sciences, vol. 6, no. 2, pp. 97-103, 2007.
Qilin Zheng, Zongwei Wang, Nanbo Gong, Zhizhen Yu, Cheng Chen, Yimao Cai, Qianqian Huang, Hao Jiang, Qiangfei Xia, and Ru Huang, "Artificial neural network based on doped HfO2 ferroelectric capacitors with multilevel characteristics," IEEE Electron Device Letters, vol. 40, no. 8, pp. 1309-1312, 2019.
Mirko Prezioso, Farnood Merrikh-Bayat, Brian D Hoskins, Gina C Adam, Konstantin K Likharev, and Dmitri B Strukov, "Training and operation of an integrated neuromorphic network based on metal-oxide memristors," Nature, vol. 521, no. 7550, pp. 61-64, 2015.
Matthew Jerry, Pai-Yu Chen, Jianchi Zhang, Pankaj Sharma, Kai Ni, Shimeng Yu, and Suman Datta, "Ferroelectric FET analog synapse for acceleration of deep neural network training," in 2017 IEEE international electron devices meeting (IEDM), 2017: IEEE, pp. 6.2. 1-6.2. 4.
H Mulaosmanovic, J Ocker, S Müller, M Noack, J Müller, P Polakowski, T Mikolajick, and S Slesazeck, "Novel ferroelectric FET based synapse for neuromorphic systems," in 2017 Symposium on VLSI Technology, 2017: IEEE, pp. T176-T177.
Ke Yang, J Joshua Yang, Ru Huang, and Yuchao Yang, "Nonlinearity in memristors for neuromorphic dynamic systems," Small Science, vol. 2, no. 1, p. 2100049, 2022.
Simone Bertolazzi, Paolo Bondavalli, Stephan Roche, Tamer San, Sung‐Yool Choi, Luigi Colombo, Francesco Bonaccorso, and Paolo Samorì, "Nonvolatile memories based on graphene and related 2D materials," Advanced materials, vol. 31, no. 10, p. 1806663, 2019.
Li Jin, Fei Li, and Shujun Zhang, "Decoding the fingerprint of ferroelectric loops: comprehension of the material properties and structures," Journal of the American Ceramic Society, vol. 97, no. 1, pp. 1-27, 2014.
FB McLean, HE Boesch, and JM McGarrity, "Hole transport and recovery characteristics of SiO2 gate insulators," IEEE Transactions on Nuclear Science, vol. 23, no. 6, pp. 1506-1512, 1976.
John Robertson, "High dielectric constant oxides," The European Physical Journal-Applied Physics, vol. 28, no. 3, pp. 265-291, 2004.
Mohamed A Al-Amoudi, "Determining dielectric constants of glass and thin film using a parallel plate capacitor," International Journal of Applied Science and Engineering Review (IJASER), vol. 1, no. 4, pp. 1-11, 2020.
John Robertson, "High dielectric constant gate oxides for metal oxide Si transistors," Reports on progress in Physics, vol. 69, no. 2, p. 327, 2005.
A Chernikova, M Kozodaev, A Markeev, Yu Matveev, D Negrov, and O Orlov, "Confinement-free annealing induced ferroelectricity in Hf0.5Zr0.5O2 thin films," Microelectronic Engineering, vol. 147, pp. 15-18, 2015.
Chia-Chi Fan, Chun-Hu Cheng, Yi-Ru Chen, Chien Liu, and Chun-Yen Chang, "Energy-efficient HfAlOx NCFET: Using gate strain and defect passivation to realize nearly hysteresis-free sub-25mV/dec switch with ultralow leakage," in 2017 IEEE International Electron Devices Meeting (IEDM), 2017: IEEE, pp. 23.2. 1-23.2. 4.
MH Lin, CC Fan, HH Hsu, C Liu, KM Chen, CH Cheng, and CY Chang, "On the electrical characteristics of ferroelectric FinFET using hafnium zirconium oxide with optimized gate stack," ECS Journal of Solid State Science and Technology, vol. 7, no. 11, p. P640, 2018.
Chien Liu, Yi-Chun Tung, Tian-Li Wu, Chun-Hu Cheng, Chih-Yang Tseng, Hsuan-Han Chen, Hsi-Han Chen, Jun Ma, Chien-Liang Lin, and Zhi-Wei Zheng, "Gamma‐Ray Irradiation Effect on Ferroelectric Devices with Hafnium Aluminum Oxides," physica status solidi (RRL)–Rapid Research Letters, vol. 13, no. 12, p. 1900414, 2019.
John Robertson, "Band offsets of wide-band-gap oxides and implications for future electronic devices," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, vol. 18, no. 3, pp. 1785-1791, 2000.
Bingwen Liu, Yating Cao, Wei Zhang, and Yubao Li, "Excellent ferroelectric Hf0.5Zr0.5O2 thin films with ultra-thin Al2O3 serving as capping layer," Applied Physics Letters, vol. 119, no. 17, p. 172902, 2021.
Hsuan-Han Chen, Ruo-Yin Liao, Wu-Ching Chou, Hsiao-Hsuan Hsu, Chun-Hu Cheng, and Ching-Chien Huang, "Ferroelectric Polarization Enhancement in Hafnium-Based Oxides Through Capping Layer Engineering," IEEE Journal of the Electron Devices Society, vol. 10, pp. 947-952, 2022.
MA Caravaca and RA Casali, "Ab initio localized basis set study of structural parameters and elastic properties of HfO2 polymorphs," Journal of Physics: Condensed Matter, vol. 17, no. 37, p. 5795, 2005.
John E Jaffe, Rafał A Bachorz, and Maciej Gutowski, "Low-temperature polymorphs of ZrO2 and HfO2: A density-functional theory study," Physical Review B, vol. 72, no. 14, p. 144107, 2005.
A Jayaraman, SY Wang, SK Sharma, and LC Ming, "Pressure-induced phase transformations in HfO2 to 50 GPa studied by Raman spectroscopy," Physical Review B, vol. 48, no. 13, p. 9205, 1993.
Lin-Gun Liu, "New high pressure phases of ZrO2 and HfO2," Journal of Physics and Chemistry of Solids, vol. 41, no. 4, pp. 331-334, 1980.
Ragesh Puthenkovilakam and Jane P Chang, "An accurate determination of barrier heights at the HfO2∕Si interfaces," Journal of applied physics, vol. 96, no. 5, pp. 2701-2707, 2004.
Manish Jain, James R Chelikowsky, and Steven G Louie, "Quasiparticle excitations and charge transition levels of oxygen vacancies in hafnia," Physical Review Letters, vol. 107, no. 21, p. 216803, 2011.
Yin Wang, Ferdows Zahid, Jian Wang, and Hong Guo, "Structure and dielectric properties of amorphous high-κ oxides: HfO2, ZrO2, and their alloys," Physical Review B, vol. 85, no. 22, p. 224110, 2012.
Sandip Mondal and V Venkataraman, "All inorganic spin-coated nanoparticle-based capacitive memory devices," IEEE Electron Device Letters, vol. 37, no. 4, pp. 396-399, 2016.
Arvind Kumar, Sandip Mondal, and KSR Koteswara Rao, "Tunable band alignment and dielectric constant of solution route fabricated Al/HfO2/Si gate stack for CMOS applications," Journal of Applied Physics, vol. 121, no. 8, 2017.
Choong-Ki Lee, Eunae Cho, Hyo-Sug Lee, Cheol Seong Hwang, and Seungwu Han, "First-principles study on doping and phase stability of HfO2," Physical Review B, vol. 78, no. 1, p. 012102, 2008.
Jiho Seo and Changhwan Shin, "Experimental study of interface traps in MOS capacitor with Al-doped HfO2," Semiconductor Science and Technology, vol. 35, no. 8, p. 085029, 2020.
TS Böscke, J Müller, D Bräuhaus, U Schröder, and U Böttger, "Ferroelectricity in hafnium oxide: CMOS compatible ferroelectric field effect transistors," in 2011 International electron devices meeting, 2011: IEEE, pp. 24.5. 1-24.5. 4.
Malcolm E Lines and Alastair M Glass, Principles and applications of ferroelectrics and related materials. Oxford university press, 2001.
Erich H Kisi, "Influence of Hydrostatic Pressure on the t→ o Transformation in Mg‐PSZ Studied by In Situ Neutron Diffraction," Journal of the American Ceramic Society, vol. 81, no. 3, pp. 741-745, 1998.
David B Marshall, Michael R Jarnes, and John R Porter, "Structural and Mechanical Property Changes in Toughened Magnesia‐Partially‐Stabilized Zirconia at Low Temperatures," Journal of the American Ceramic Society, vol. 72, no. 2, pp. 218-227, 1989.
Erich H Kisi and CJ Howard, "Crystal structures of zirconia phases and their inter-relation," Key Engineering Materials, vol. 153, pp. 1-36, 1998.
Tran Doan Huan, Vinit Sharma, George A Rossetti Jr, and Rampi Ramprasad, "Pathways towards ferroelectricity in hafnia," Physical Review B, vol. 90, no. 6, p. 064111, 2014.
Zhen Fan, Jingsheng Chen, and John Wang, "Ferroelectric HfO2-based materials for next-generation ferroelectric memories," Journal of Advanced Dielectrics, vol. 6, no. 02, p. 1630003, 2016.
Stefan Mueller, Johannes Mueller, Aarti Singh, Stefan Riedel, Jonas Sundqvist, Uwe Schroeder, and Thomas Mikolajick, "Incipient ferroelectricity in Al‐doped HfO2 thin films," Advanced Functional Materials, vol. 22, no. 11, pp. 2412-2417, 2012.
Johannes Muller, Tim S Boscke, Uwe Schroder, Stefan Mueller, Dennis Brauhaus, Ulrich Bottger, Lothar Frey, and Thomas Mikolajick, "Ferroelectricity in simple binary ZrO2 and HfO2," Nano letters, vol. 12, no. 8, pp. 4318-4323, 2012.
Jessica Spurrell, "Thermal stability and current transfer in twisted-pair helium gas-cooled MgB2 DC cables," University of Southampton, 2017.
Tun-Jen Chang, Chien Liu, Chia-Chi Fan, Hsiao-Hsuan Hsu, Hsuan-Han Chen, Wan-Hsin Chen, Yu-Chi Fan, Tsung-Ming Lee, Chien-Liang Lin, and Jun Ma, "Investigation on polarization characteristics of ferroelectric memories with thermally stable hafnium aluminum oxides," Vacuum, vol. 166, pp. 11-14, 2019.
Pan Kwi Park and Sang-Won Kang, "Enhancement of dielectric constant in HfO2 thin films by the addition of Al2O3," Applied physics letters, vol. 89, no. 19, 2006.
Md Mamunur Rahman, Jun-Gyu Kim, Dae-Hyun Kim, and Tae-Woo Kim, "Characterization of Al incorporation into HfO2 dielectric by atomic layer deposition," Micromachines, vol. 10, no. 6, p. 361, 2019.
Kuan-Wei Liu, Hsuan-Han Chen, Zhong-Ying Huang, Wei-Chun Wang, Yu-Chi Fan, Ching-Liang Lin, Chih-Chieh Hsu, Chia-Chi Fan, Hsiao-Hsuan Hsu, and Chun-Yen Chang, "Investigation of phase transformation in HfO2 ferroelectric capacitor by means of a ZrO2 capping layer," in 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), 2019: IEEE, pp. 1-3.
Jiali Wang, Dao Wang, Qiang Li, Aihua Zhang, Dong Gao, Min Guo, Jiajun Feng, Zhen Fan, Deyang Chen, and Minghui Qin, "Excellent ferroelectric properties of Hf0.5Zr0.5O2 thin films induced by Al2O3 dielectric layer," IEEE Electron Device Letters, vol. 40, no. 12, pp. 1937-1940, 2019.
Jiaxian Wan, Xue Chen, Liwei Ji, Zexin Tu, Hao Wu, and Chang Liu, "Ferroelectricity of Hf0.5Zr0.5O2 Thin Films Free From the Influence of Electrodes by Using Al₂O₃ Capping Layers," IEEE Transactions on Electron Devices, vol. 69, no. 4, pp. 1805-1810, 2022.
Yu-Chun Li, Xiao-Xi Li, Mao-Kun Wu, Bo-Yao Cui, Xue-Pei Wang, Teng Huang, Ze-Yu Gu, Zhi-Gang Ji, Ying-Guo Yang, and David Wei Zhang, "Dual Al₂O₃ / Hf0.5Zr0.5O2 Stack Thin Films for Improved Ferroelectricity and Reliability," IEEE Electron Device Letters, vol. 43, no. 8, pp. 1235-1238, 2022.
DH Triyoso, PJ Tobin, BE White, R Gregory, and XD Wang, "Impact of film properties of atomic layer deposited HfO2 resulting from annealing with a TiN capping layer," Applied physics letters, vol. 89, no. 13, 2006.
Shelby S Fields, Truong Cai, Samantha T Jaszewski, Alejandro Salanova, Takanori Mimura, Helge H Heinrich, Michael David Henry, Kyle P Kelley, Brian W Sheldon, and Jon F Ihlefeld, "Origin of ferroelectric phase stabilization via the clamping effect in ferroelectric hafnium zirconium oxide thin films," Advanced Electronic Materials, vol. 8, no. 12, p. 2200601, 2022.
B Dickens, E Balizer, AS DeReggi, and SC Roth, "Hysteresis measurements of remanent polarization and coercive field in polymers," Journal of applied physics, vol. 72, no. 9, pp. 4258-4264, 1992.
T Schenk, E Yurchuk, S Mueller, U Schroeder, S Starschich, U Böttger, and T Mikolajick, "About the deformation of ferroelectric hystereses," Applied physics reviews, vol. 1, no. 4, 2014.
James F Scott, CA Araujo, H Brett Meadows, LD McMillan, and A Shawabkeh, "Radiation effects on ferroelectric thin‐film memories: Retention failure mechanisms," Journal of applied physics, vol. 66, no. 3, pp. 1444-1453, 1989.
Milan Pešić, Franz Paul Gustav Fengler, Luca Larcher, Andrea Padovani, Tony Schenk, Everett D Grimley, Xiahan Sang, James M LeBeau, Stefan Slesazeck, and Uwe Schroeder, "Physical mechanisms behind the field‐cycling behavior of HfO2‐based ferroelectric capacitors," Advanced Functional Materials, vol. 26, no. 25, pp. 4601-4612, 2016.
Ying Zhu, Yongli He, Chunsheng Chen, Li Zhu, Huiwu Mao, Yixin Zhu, Xiangjing Wang, Yang Yang, Changjin Wan, and Qing Wan, "HfZrOx-based capacitive synapses with highly linear and symmetric multilevel characteristics for neuromorphic computing," Applied Physics Letters, vol. 120, no. 11, 2022.
K Piskorski and HM Przewlocki, "The methods to determine flat-band voltage VFB in semiconductor of a MOS structure," in The 33rd International Convention MIPRO, 2010: IEEE, pp. 37-42.
Edward H Nicollian and John R Brews, MOS (metal oxide semiconductor) physics and technology. John Wiley & Sons, 2002.
Dong-Qi Xiao, Bin-Bin Luo, Wen Xiong, Xiaohan Wu, David Wei Zhang, and Shi-Jin Ding, "Low thermal budget fabrication and performance comparison of MFM capacitors with thermal and plasma-enhanced atomic layer deposited Hf0.45Zr0.55Ox ferroelectrics," IEEE Transactions on Electron Devices, vol. 68, no. 12, pp. 6359-6364, 2021.
Jinchen Wei, Lilai Jiang, Menglin Huang, Yuning Wu, and Shiyou Chen, "Intrinsic Defect Limit to the Growth of Orthorhombic HfO2 and (Hf, Zr) O2 with Strong Ferroelectricity: First‐Principles Insights," Advanced Functional Materials, vol. 31, no. 42, p. 2104913, 2021.
Kandabara Tapily, Steve Consiglio, Robert Clark, Relja Vasic, Cory Wajda, Jean Jordan-Sweet, Gert Leusink, and AC Diebold, "Higher-K Formation in Atomic Layer Deposited Hf1-XAlxOy," ECS Transactions, vol. 64, no. 9, p. 123, 2014.
Shimeng Yu, Pai-Yu Chen, Yu Cao, Lixue Xia, Yu Wang, and Huaqiang Wu, "Scaling-up resistive synaptic arrays for neuro-inspired architecture: Challenges and prospect," in 2015 IEEE International Electron Devices Meeting (IEDM), 2015: IEEE, pp. 17.3. 1-17.3. 4.
Milan Pesic, Andrea Padovani, Stefan Slcsazeck, Thomas Mikolajick, and Luca Larcher, "Deconvoluting charge trapping and nucleation interplay in FeFETs: Kinetics and Reliability," in 2018 IEEE International Electron Devices Meeting (IEDM), 2018: IEEE, pp. 25.1. 1-25.1. 4.
Ekaterina Yurchuk, Johannes Müller, Stefan Müller, Jan Paul, Milan Pešić, Ralf van Bentum, Uwe Schroeder, and Thomas Mikolajick, "Charge-trapping phenomena in HfO2-based FeFET-type nonvolatile memories," IEEE Transactions on Electron Devices, vol. 63, no. 9, pp. 3501-3507, 2016.