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研究生: 楊士緯
Shih-Wei Yang
論文名稱: 高頻振動輔助微線切割放電加工技術開發與高密度超高細長比精微陣列探針製作研究
Development of a high-frequency vibration assisted micro w-EDM technique and research of high-spatial-density, ultra-high-aspect-ratio micro probe array fabrication
指導教授: 陳順同
Chen, Shun-Tong
學位類別: 碩士
Master
系所名稱: 機電工程學系
Department of Mechatronic Engineering
論文出版年: 2013
畢業學年度: 101
語文別: 中文
論文頁數: 74
中文關鍵詞: 精微線切割放電加工高密度及超高細長比精微陣列式探針高頻振動
英文關鍵詞: micro w-EDM, High-spatial-density and ultra-high-aspect-ratio micro probe array, high-frequency vibration
論文種類: 學術論文
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  • 精微線切割放電加工(Micro w-EDM)適用於高深寬比(High-aspect-ratio)微細元件的切割加工,尤以具高密度且高細長比的精微陣列式探針(High-spatial-density, high-aspect-ratio micro probe array)最為適合;但線切割放電加工過程中,放電殘渣(Discharge debris)易殘留於工件與細線電極間,導致二次放電(Secondary discharge)甚至短路(Short)發生,影響加工效率。鑒此,本研究發展一套具「精微線切割放電加工機能」的桌上型CNC工具機(Tabletop micro CNC w-EDM machine),並提出以高頻振動(High-frequency vibration)輔助精微線切割放電加工的方法,即建構壓電陶瓷材料(Piezoelectric ceramic material)於銅線川流的路徑上,用以對微細銅線進行高頻振動輔助,目的在幫助放電殘渣(Discharge debris)排除,以減少二次放電與短路機會。研究證實,本實驗所提原創技術,能加工出10×10陣列,尺寸23×23×2,500μm的高密度且具超高細長比的精微陣列式探針,其細長比超過100:1,非常適用於具高深寬比的微細結構,如3D-IC電路之檢測。而以高頻振動輔助進行切割加工,其所耗時間約是未開啟振動輔助加工所耗時間的75-80%,直線精度亦不因振動輔助而受影響,證實高頻振動輔助能有效提高線切割放電加工的效能,成功實現高速度高精度的精微線切割放電加工法,此項研究成果,深具商用價值。

    Micro w-EDM (wire Electrical Discharge Machining) is highly suitable for machining of high-aspect-ratio micro components. However, there is a difficulty in the removal of debris during the machining resulting in secondary discharge even short happening easily in the micro gap. A micro w-EDM technique specifically for machining high-spatial-density and ultra-high-aspect-ratio micro structures is developed in this thesis. A tabletop CNC machine equipped with a complete micro w-EDM system for wire tension (20µm in diameter) control is designed and employed for the study of ultra-high-aspect-ratio micro probe array fabrication. A high-frequency vibration assisted technique that the micro wire is vibrated radially with micro scale via a piezoelectric ceramic material is proposed to assist in the removal of debris and reduce the frequencies of secondary discharge and short. Experimental results demonstrate that the proposed approach can fabricate high-spatial-density and ultra-high-aspect-ratio micro structure with 10x10 squared probes. The finished probe array that have the dimensions of 23×23×2,500μm and the aspect ratio of over 100 is qualified to detect the micro structural circuit, 3D-IC especially. In addition, the time is about four-fifth of the machining time for without high-frequency vibration assisted. The machining efficiency is greatly improved and achieve a high -speed and -accuracy micro w-EDM approach. These experimental results will be of substantial benefit to precision machining.

    中文摘要 i Abstract ii 誌謝 iii 目錄 iv 表目錄 vii 圖目錄 ix 符號說明 xii 第一章 緒論 1 1.1 前言 1 1.2 研究動機 3 1.3 研究目的 4 1.4 研究方法 5 1.5 文獻回顧 6 1.5.1 振動輔助應用於放電加工 6 1.5.2 精微陣列探針成型 11 第二章 實驗原理 16 2.1精微放電加加工原理 16 2.2精微線切割放電加工原理 17 2.3壓電效應 18 第三章 實驗設備與設計 21 3.1 CNC線切割放電加工機 21 3.2壓電陶瓷材料高頻微振動裝置 22 3.2.1 壓電陶瓷材料特性 22 3.2.2 函數波信號產生器與功率放大器 22 3.3高剛性桌上型工具機 23 3.4微型直流馬達 24 3.5實驗材料 25 3.5.1微細銅線(電極) 25 3.5.2碳化鎢(工件) 26 3.6量測儀器設備 26 3.6.1工具光學顯微鏡 26 3.6.2掃描式電子顯微鏡 27 3.6.3 3D測量雷射共焦顯微鏡 27 3.6.4混合訊號示波器 28 3.6.5電流探棒 28 第四章 高細長比微細探針切割實驗 30 4.1 精微線切割放電機構設計 31 4.1.1精微線切割放電加工機構設計 31 4.1.2微細線電極張力控制設計 31 4.1.3 RC放電加工迴路設計 32 4.1.4微放電加工迴路與短路判斷機制 33 4.1.5壓電陶瓷材料載台設計 34 4.1.6壓電陶瓷振動方向與放電殘渣排除機制 35 4.1.7放置壓電材料與否與切割筆直度關係 36 4.2 線徑50µm銅線之切割效能比較 37 4.2.1細銅線振動頻率與切割效能比較 37 4.2.2微細銅線進給率與切割效能比較 38 4.3 線徑20µm銅線之切割效能比較 40 4.3.1微細銅線振動頻率與切割效能比較 40 4.3.2微細銅線進給率與切割效能比較 41 4.3.3微細銅線振動與否對槽寬的影響 42 4.3.4不同轉角路徑之切割效能比較 43 4.3.5不同放電電容值之槽寬影響 44 4.3.6送線速度對切割進給率的影響 46 4.4高細長比微細探針受力形變分析討論 47 第五章 高密度超高細長比精微陣列式探針實驗驗證 50 5.1 高細長比微細探針應用 50 5.2 以線徑50µm微細銅線切割高細長比微型結構驗證及討論 51 5.2.1高密度探針陣列微型結構規劃(細長比36:1) 51 5.2.2高密度探針陣列微型結構規劃(細長比86:1) 53 5.3 以線徑20µm微細銅線切割高細長比微型結構驗證及討論 54 5.3.1電極磨耗影響 54 5.3.2高密度精微陣列探針完成後之清潔問題 55 5.3.3高密度超高細長比探針陣列微型結構規劃(細長比104:1) 57 5.3.4細線電極振動與否之表面粗糙度探討 60 5.3.5高密度探針陣列微型結構規劃(造型1) 60 5.3.6高密度探針陣列微型結構規劃(造型2) 62 第六章 結論與未來展望 65 6.1結論 65 6.2未來展望 66 參考文獻 68

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