我們利用歐傑電子能譜(Auger Electron Spectroscopy, AES)、低能電子繞射(Low Energy Electron Diffraction, LEED)、以及紫外光電子能譜術(Ultraviolet Photoelectron Spectroscopy, UPS)來深入探討鎳超薄膜鍍於 1ML Co / Pt(111) 的成長模式以及在高溫形成合金時的成份、結構變化。
室溫下,鎳薄膜鍍於1ML Co / Pt(111)的成長模式為兩層平整成長之後再以三維島狀的S. K mode。由AES、LEED均能得到相同的結論。
x ML Ni / 1 ML Co / Pt(111) 系統 (x=0.5、1、2、3)在升溫的過程中,鈷、鎳原子會在440K先形成混合態,隨著溫度的升高鈷、鎳原子均會往白金擴散,隨著鎳厚度的增加,鈷、鎳混合層往白金擴散的溫度也隨之增加。當鎳層數為0.5ML、1ML、2ML、3ML時,開始擴散的溫度分別為550K、580K、600K、620K。
在1ML Ni / 1ML Co / Pt(111)系統在經過退火效應後,LEED繞射圖形在580K前為(1×1)周圍有六角衛星點,超過580K時六角衛星點便會消失,而在650K時(1×1)周圍又出現了更小的三對稱的六角衛星點,700K時在每個(1×1)主繞射點周圍繞射點只能看到其中三個小衛星點,800K時衛星點又再次消失,為(1×1)的繞射亮點。
從離子濺射的深度分析中,我們發現1ML Ni / 1ML Co / Pt(111)經過750K的退火效應後,鎳原子擴散比鈷原子還要深,而表面則以Co、Pt兩種原子為主。
UPS以及I-V LEED分析中,系統在升溫至580K以上,皆出現明顯的變化,此與AES中鈷、鎳往白金擴散的溫度相呼應。
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