研究生: |
莊翼宇 Yi-Yu Chuang |
---|---|
論文名稱: |
一維三元金屬介電質光子晶體溫度效應之研究 THERMAL EXTENSION IN A ONE-DIMENSIONAL TERNARY METAL-DIELECTRIC PHOTONIC CRYSTAL |
指導教授: |
吳謙讓
Wu, Chien-Jang |
學位類別: |
博士 Doctor |
系所名稱: |
光電工程研究所 Graduate Institute of Electro-Optical Engineering |
論文出版年: | 2010 |
畢業學年度: | 98 |
語文別: | 英文 |
論文頁數: | 33 |
中文關鍵詞: | 溫度效應 、光子晶體 、金屬介電質光子晶體 、一維 、高頻 |
英文關鍵詞: | thermal expasion, photonic crystals, one-dimensional, MDPC, high frequency |
論文種類: | 學術論文 |
相關次數: | 點閱:148 下載:0 |
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光子晶體是兩個或兩個以上不同折射率的物質光學週期性層所組成,光子晶體的基本特性是存在著一些禁帶,在禁帶中電磁波是被禁止傳遞在整個結構。這個禁帶叫做光子能隙。
在此篇論文中,我們首先討論光子能隙的拓寬在三元金屬介電質光子晶體,可以得知光子晶體明顯的增寬是因為金屬層的存在。
在第二部分我們探討溫度對光子能隙所造成的效應,考慮熱膨脹造成厚度變化,不同溫度會使結構厚度變化,因此造成能隙邊緣將會偏移, 監控能帶邊緣偏移的行為將會觀察到溫度造成的影響。在使用光子晶體設計溫度相依的感測器上溫度效應的研究提供一些有用的資訊。
理論上分析在第二章會提到使用TMM法,第一章是在簡短介紹光子晶體,主要的主題被安插在第三章跟第四章,第五章是結論。
Photonic crystals (PCs) are optically periodic layered media made of two or more materials with different refractive indices. A basic feature of PCs is that there exist some stop bands within which electromagnetic waves are prohibited to propagate through the whole structure. These stop bands are called the photonic band gaps (PBGs).
In this thesis, we first investigate the enhancement of PBG in a ternary metal-dielectric photonic crystal (MDPC). It can be seen that the PBG is significantly enlarged due to the presence of the metal layer.
In the second part, we shall investigate the temperature effect on the PBG. We consider the thickness variation due to the thermal expansion. The band edges will be shifted due to the thickness change in the constituent at different temperature. By monitoring the shifting behavior in the band edges, the effect of temperature can be observed. The study of this effect provides some useful information that is useful in the design of a temperature-dependent sensor using the PCs.
The theoretical analysis made is based on the transfer matrix method which is given in Chapter 2. Chapter 1 is to give a brief introduction of PCs. Main topics are arranged in Chapters 3 and 4, respectively. The conclusion is in Chapter 5.
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